Phosphoric Acid-Etching Promotes Bond Strength and Formation of Acid-Base Resistant Zone on Enamel
Phosphoric Acid-Etching Promotes Bond Strength and Formation of Acid-Base Resistant Zone on Enamel
复制标题
磷酸蚀刻促进牙釉质结合强度和耐酸碱区的形成
DOI:
10.2341/11-422-l
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发表时间:
2013-01-01
影响因子:
2.2
通讯作者:
Tagami, J.
中科院分区:
文献类型:
--
作者:
Li, N.;Nikaido, T.;Tagami, J.
This study examined the effect of phosphoric acid (PA) etching on the bond strength and acid-base resistant zone (ABRZ) formation of a two-step self-etching adhesive (SEA) system to enamel. An etch-and-rinse adhesive (EAR) system Single Bond (SB) and a two-step SEA system Clearfil SE Bond (SE) were used. Human teeth were randomly divided into four groups according to different adhesive treatments: 1) SB; 2) SE; 3) 35% PA etching SE primer SE adhesive (PA/SEp+a); (4) 35% PA etching SE adhesive (PA/SEa). Microshear bond strength to enamel was measured and then statistically analyzed using one-way analysis of variance and the Tukey honestly significant difference test. The failure mode was recorded and analyzed by e test. The etching pattern of the enamel surface was observed with scanning electron microscope (SEM). The bonded interface was exposed to a demineralizing solution (pH=4.5) for 4.5 hours and then 5% sodium hypochlorite with ultrasonication for 30 minutes. After argon-ion etching, the interfacial ultrastructure was observed using SEM. The microshear bond strength to enamel of the SE group was significantly lower (p