An investigation of the effect of SiC particle size on Cu-SiC composites
An investigation of the effect of SiC particle size on Cu-SiC composites
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DOI：
10.1016/j.compositesb.2012.01.006
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发表时间：
2012-06-01
影响因子：
13.1
通讯作者：
Bindal, C.
中科院分区：
文献类型：
--
作者：
Efe, G. Celebi;Ipek, M.;Bindal, C.
在这项研究中，通过添加1 wt.%，2重量%，3重量%和5重量% SiC颗粒进入基体。具有1 μ m、5 μ m和30 μ m尺寸的SiC颗粒用作增强体。采用粉末冶金法制备复合材料试样，在开放式气氛炉中于700 ℃烧结2 h。光学和SEM研究表明，增强颗粒分布均匀。XRD分析表明，烧结复合材料中的主要成分为Cu和SiC。复合材料的相对密度和电导率随SiC含量的增加而降低，随SiC颗粒尺寸的增加而增加。复合材料的硬度随SiC颗粒的加入量和颗粒尺寸的增大而增大。对于Cu-1 wt.%，获得了98%的最大相对密度和96%IACS的电导率粒度为30 μ m的SiC。(C)2012爱思唯尔有限公司保留所有权利。
In this study mechanical properties of copper were enhanced by adding 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles into the matrix. SiC particles of having 1 mu m, 5 mu m and 30 mu m sizes were used as reinforcement. Composite samples were produced by powder metallurgy method and sintering was performed in an open atmospheric furnace at 700 degrees C for 2 h. Optical and SEM studies showed that the distribution of the reinforced particle was uniform. XRD analysis indicated that the dominant components in the sintered composites were Cu and SiC. Relative density and electrical conductivity of the composites decreased with increasing the amount of SiC and increased with increasing SiC particle size. Hardness of the composites increased with both amount and the particle size of SiC particles. A maximum relative density of 98% and electrical conductivity of 96% IACS were obtained for Cu-1 wt.% SiC with 30 mu m particle size. (C) 2012 Elsevier Ltd. All rights reserved.