Uniform and Ordered Copper Nanomeshes by Microsphere Lithography for Transparent Electrodes
Uniform and Ordered Copper Nanomeshes by Microsphere Lithography for Transparent Electrodes
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DOI：
10.1021/nl5003075
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发表时间：
2014-04-01
期刊：
影响因子：
10.8
通讯作者：
Leu, Paul W.
中科院分区：
文献类型：
--
作者：
Gao, Tongchuan;Wang, Baomin;Leu, Paul W.
我们报告了一项关于均匀和有序铜纳米壳（CU NMS）的光学和电子特性的综合模拟和实验研究，以确定它们在透明导体中的性能。我们的研究包括模拟，以确定传播模式在传播和实验中的作用，这些模式证明了一种可扩展的基于微球的方法，可以在刚性石英和柔性聚乙烯二甲酸酯底物上制造NMS。制造方法允许对NM形态进行精确控制，并在刚性基板上的大面积上具有近乎完美的均匀性和远程顺序。我们的Cu NMS在17欧米茄/平方的石英上显示了80％的扩散透射，与二锡氧化物相当。我们还进行了耐久性实验，以证明这些Cu NMS在弯曲，加热和磨损中是可靠的。
We report a comprehensive simulation and experimental study on the optical and electronic properties of uniform and ordered copper nanomeshes (Cu NMs) to determine their performance for transparent conductors. Our study includes simulations to determine the role of propagating modes in transmission and experiments that demonstrate a scalable, facile microsphere-based method to fabricate NMs on rigid quartz and flexible polyethylene terephthalate substrates. The fabrication method allows for precise control over NM morphology with near-perfect uniformity and long-range order over large areas on rigid substrates. Our Cu NMs demonstrate 80% diffuse transmission at 17 Omega/square on quartz, which is comparable to indium tin oxide. We also performed durability experiments that demonstrate these Cu NMs are robust from bending, heating, and abrasion.