Investigation of the deposition conditions on the microstructure of TiZrCuPd nano-glass thin films

Investigation of the deposition conditions on the microstructure of TiZrCuPd nano-glass thin films
复制标题

DOI:
10.1016/j.matchar.2017.07.014
复制
发表时间:
2017-09
影响因子:
4.7
通讯作者:
M. Mohri;Di Wang;J. Ivanisenko;H. Gleiter;H. Hahn
M. Mohri;Di Wang;J. Ivanisenko;H. Gleiter;H. Hahn
中科院分区:
材料科学1区
文献类型:
--
作者:
M. Mohri;Di Wang;J. Ivanisenko;H. Gleiter;H. Hahn

文献摘要

相似文献

采用合金靶直流磁控溅射法在室温下在Si衬底上制备了纳米晶Ti-Zr-Cu-Pd金属玻璃薄膜。分析了直流功率、溅射气压等溅射工艺参数对薄膜化学成分和微观结构的影响。通过改变溅射压力(从0.2至0.8Pa)进行实验,并且所使用的溅射功率为100或200 W。溅射压力和施加功率的组成变化被认为是由于原子间碰撞的溅射原子的动能耗散。通过X射线衍射和高分辨透射电子显微镜(HRTEM)的沉积薄膜的微结构研究表明,薄膜具有非晶结构。在较高的Ar气压下沉积的薄膜中观察到纳米尺寸的玻璃团簇。利用扫描电子显微镜(SEM)和原子力显微镜(AFM)研究了Ti-Zr-Cu-Pd薄膜的表面形貌。沉积的薄膜呈颗粒状,其表面粗糙度的影响,由Ar压力。在低溅射压力下,表面形貌的特征在于低的表面粗糙度。此外,可以通过改变溅射参数来控制纳米玻璃薄膜中的化学成分和玻璃化区域的尺寸。
Nano-grained metallic glass Ti-Zr-Cu-Pd thin films were deposited at room temperature on Si substrate by using direct current (DC) magnetron sputtering with an alloy target. The influence of the sputtering parameters like the DC power and sputtering pressure on the chemical composition and the microstructure of the deposited films was analyzed. Experiments were carried out by changing the sputtering pressure (from 0.2 to 0.8 Pa) and the sputtering power used was 100 or 200 W. The compositional variation with sputtering pressure and applied power was found to be due to the dissipation of the kinetic energy of the sputtered atoms by the interatomic collision. Microstructural studies of the as-deposited thin films by X-ray diffraction and high-resolution transmission electron microscopy (HRTEM) exhibited that the films have an amorphous structure. Nanometer-sized glassy clusters were observed in the thin films deposited at higher Ar pressure. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to study the surface morphology and topography of the Ti-Zr-Cu-Pd thin films. The as-deposited thin films exhibited granular morphology and its surface roughness was influenced by the Ar pressure. At low sputtering pressures, the surface morphology is characterized by low surface roughness. Moreover, the chemical composition and the size of glassy regions in the nano-glass thin films can be controlled by changing the sputtering parameters.