Effect of plasma polymer deposition methods on copper corrosion protection
Effect of plasma polymer deposition methods on copper corrosion protection
复制标题
等离子体聚合物沉积方法对铜腐蚀防护的影响
DOI：
--
复制
发表时间：
1996
期刊：
影响因子：
--
通讯作者：
H. Yasuda
中科院分区：
文献类型：
--
作者：
Y. Lin;H. Yasuda
研究了用于铜腐蚀保护的等离子聚合物涂层在直流阴极聚合、有或没有阳极磁控管增强、自动对焦磁控管辉光放电聚合和射频辉光放电聚合中的行为。视觉和扫描电子显微镜观察相结合，确定了含有 0.1N 氯离子的加速湿/干循环腐蚀测试环境的总体趋势。 TMS 的直流阳极磁控管阴极聚合提供了最佳的铜腐蚀保护，因为沉积的等离子体聚合物在铜基板上的沉积均匀性和粘附性得到了增强。当无涂层铜在一个循环中遭受严重的普遍腐蚀时，经过 25 次湿/干循环加速腐蚀测试后，未观察到腐蚀。本研究范围内进行的低能量输入密度下的 C4F10 + H2 (1:1) 等离子体聚合涂层以及高能量输入和高沉积厚度下的甲烷等离子体聚合涂层也实现了卓越的腐蚀保护。等离子聚合物的应用表现出高水蒸气渗透性和表面动态稳定性，大大降低了点蚀密度。 © 1996 约翰威利父子公司。
The behavior of plasma polymer coating for Cu corrosion protection was investigated in dc cathodic polymerization, with and without anode magnetron enhancement, af magnetron glow discharge polymerization, and rf glow discharge polymerization. The combination of visual and scanning electron microscopy observations established general trends in an accelerated wet/dry cycle corrosion testing environment containing 0.1N chloride ions. Dc anodic magnetron cathodic polymerization of TMS offered the best Cu corrosion protection due to an enhanced deposition uniformity and adhesion of the deposited plasma polymer to the Cu substrate. No corrosion was observed after 25 wet/dry cycle accelerated corrosion tests when uncoated Cu suffered a severely generalized attack in one cycle. Superior corrosion protection was also performed by an af plasma polymerized coating of C4F10 + H2 (1 : 1) at a low-energy input density and of methane at high-energy input and high deposition thickness carried out in the range of this study. The application of plasma polymers which showed high water vapor permeation resistance and surface dynamic stability ǵreatly reduced the pitting densities. © 1996 John Wiley & Sons, Inc.