Integrated micro-plasmas in silicon operating in helium

Integrated micro-plasmas in silicon operating in helium
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在氦气中运行的硅集成微等离子体

DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
M. Goeckner
M. Goeckner
中科院分区：
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文献类型：
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作者：
R. Dussart;L. Overzet;P. Lefaucheux;T. Dufour;M. Kulsreshath;M. Mandra;T. Tillocher;O. Aubry;S. Dozias;P. Ranson;J. B. Lee;M. Goeckner

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抽象的。 微等离子体阵列在直流状态下在氦气中操作已经产生， 硅微反应器阴极边界层（CBL）型微器件， 使用洁净室设施和半导体加工精心制作 技术.研究了具有50或100 μ m直径空腔的微放电阵列的点火。两种不同结构 （各向同性蚀刻或各向异性蚀刻腔）和各种 条件（两个不同的电压极性、压力等）是 研究了100个直径为50 μm的微放电可以在 平行于1000托。在高电流下，一些寄生和瞬态火花 出现在样品的边缘。当极化反转时 （阴极侧对应于打开的电极），需要更大的电流 来点燃所有的微放电孔周围的热影响区 在操作后获得阳极侧上的膜。
Abstract. Microplasma arrays operating in helium in a DC regime have been produced in silicon microreactors. Cathode boundary layer (CBL) type microdevices were elaborated using clean room facilities and semiconductor processing techniques. Ignition of the micro-discharge arrays having either 50 or 100 $mu $m diameter cavities was studied. Two different structures (isotropically etched or anisotropically etched cavity) and various conditions (the two different voltage polarities, pressures etc.) were investigated. 100 microdischarges of 50 μm diameter could be ignited in parallel at 1000 torr. At high current, some parasitic and transient sparks appeared at the edge of the sample. When the polarization was reversed (cathode side corresponding the opened electrode), more current was needed to light all the microdischarges. A thermally affected zone around the hole on the anode side was obtained after operation.