Deep X-Ray Lithography
Deep X-Ray Lithography
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DOI：
10.1016/b978-0-323-31149-6.00016-5
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发表时间：
2015
期刊：
影响因子：
--
通讯作者：
P. Meyer;J. Schulz
中科院分区：
文献类型：
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作者：
P. Meyer;J. Schulz
到目前为止，MEMS器件制造的领先技术是硅微加工及其各种衍生物。然而，微系统的许多应用在材料、几何形状、纵横比、尺寸、形状、微结构的精度以及部件数量方面都有要求，这些要求是主流硅基微加工技术难以满足的。LIGA是Lithography（光刻）、Electroplating（Galvanoformung）和Molding（Abformung）的德语首字母缩写，能够高精度地制造具有数百至数千微米的大结构厚度的高深宽比微结构。这些高的微结构可以用各种材料制成，具有明确的几何形状和尺寸，非常直和光滑的侧壁，以及严格的公差。LIGA技术也非常适合大规模制造零件，特别是聚合物。许多微型系统受益于LIGA工艺在产品性能方面的独特特性和优势。在本章中，强调了制造方法的优势及其主要应用领域，并列举了来自世界各地的各种团体的例子，特别是在微机械和微光学领域。几种微制造技术是目前可用的，并用于制造微组件和系统。最成功的微加工技术是作为标准IC和微电子平面硅基加工的延伸而开发的。
By far the leading technology for the manufacturing of MEMS devices is silicon micro-machining with its various derivatives. However, many applications of micro-systems have requirements in respect of materials, geometry, aspect ratio, dimensions, shape, accuracy of micro-structures, and number of parts that cannot be fulfilled easily by mainstream silicon-based micro-machining technologies. LIGA, a German acronym for Lithography (Lithographie), Electroplating (Galvanoformung), and Molding (Abformung) enables the highly precise manufacture of high aspect ratio micro-structures with large structural thickness ranging from hundreds to thousands of microns. These tall micro-structures can be produced in a variety of materials with well-defined geometry and dimensions, very straight and smooth side walls, and tight tolerances. LIGA technology is also well suited for the mass fabrication of parts, particularly in polymers. Many micro-systems benefit from the unique characteristics and advantages of the LIGA process in terms of product performance. In this chapter the strengths of the manufacturing method and its main fields of application are emphasized, with examples taken from various groups worldwide, especially in micro-mechanics and micro-optics. Several micro-fabrication technologies are available at the present time and are used to fabricate micro-components and-systems. The most successful micro-machining technologies have been developed as extensions of standard IC and micro-electronics planar silicon-based processing.