Constitutive Relation for Ambient-Temperature Creep in Hexagonal Close-Packed Metals
Constitutive Relation for Ambient-Temperature Creep in Hexagonal Close-Packed Metals
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DOI:
10.2320/matertrans.m2009223
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发表时间:
2009-12
影响因子:
1.2
通讯作者:
T. Matsunaga;T. Kameyama;Kohei Takahashi;E. Sato
中科院分区:
文献类型:
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作者:
T. Matsunaga;T. Kameyama;Kohei Takahashi;E. Sato
This paper reports creep tests on three kinds of polycrystalline hexagonal close-packed metals, i.e. commercially pure titanium, pure magnesium, and pure zinc, in the vicinity of ambient temperature even below their 0.2% proof stresses. These materials showed significant steady state creep rates around 10 -9 s -1 and had stress exponents of about 3.0. Arrhenius plots in the vicinity of ambient temperature indicate extremely low apparent activation energies, Q, of about 20 kJ/mol, which is at least one-fourth of the Q of dislocation-core diffusion. Ambient-temperature creep also has a grain-size effect with an exponent of 1.0. These parameters indicate that ambient-temperature creep is a new creep deformation mechanism in h.c.p. materials.