Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks
Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks
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DOI：
10.1038/s41563-021-00934-3
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发表时间：
2021-03-18
期刊：
影响因子：
41.2
通讯作者：
Hopkins, Patrick E.
中科院分区：
文献类型：
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作者：
Evans, Austin M.;Giri, Ashutosh;Hopkins, Patrick E.
低k电介质材料对于电子器件的持续小型化至关重要，但其低导热性限制了性能。在这里，二维共价有机框架被证明结合联合收割机高导热性与低介电常数作为微处理器的功能是小型化，低介电常数（低k）材料是必要的，以限制电子串扰，电荷积累，和信号传播延迟。然而，所有已知的低k电介质都表现出较低的热导率，这使得高功率密度芯片中的散热变得复杂。二维（2D）共价有机框架（COF）联合收割机了导致低介电常数的巨大永久孔隙率和赋予相对高热导率的周期性层状结构。然而，传统的合成路线产生的2D COF不适合于评价这些性质和整合到装置中。在这里，我们报告的高品质的COF薄膜，使热反射和阻抗谱测量的制造。这些测量结果表明，二维COF具有高的热导率（1 W m（-1）K-1）与超低的介电常数（k = 1.6）。这些结果表明，定向，分层的2D聚合物是有前途的下一代介电层，这些分子精确的材料提供了可调的有用特性的组合。
Low-k dielectric materials are essential to allow continued electronics miniaturization, but their low thermal conductivity limits performance. Here, two-dimensional covalent organic frameworks are shown to combine high thermal conductivity with a low dielectric constant.As the features of microprocessors are miniaturized, low-dielectric-constant (low-k) materials are necessary to limit electronic crosstalk, charge build-up, and signal propagation delay. However, all known low-k dielectrics exhibit low thermal conductivities, which complicate heat dissipation in high-power-density chips. Two-dimensional (2D) covalent organic frameworks (COFs) combine immense permanent porosities, which lead to low dielectric permittivities, and periodic layered structures, which grant relatively high thermal conductivities. However, conventional synthetic routes produce 2D COFs that are unsuitable for the evaluation of these properties and integration into devices. Here, we report the fabrication of high-quality COF thin films, which enable thermoreflectance and impedance spectroscopy measurements. These measurements reveal that 2D COFs have high thermal conductivities (1 W m(-1) K-1) with ultra-low dielectric permittivities (k = 1.6). These results show that oriented, layered 2D polymers are promising next-generation dielectric layers and that these molecularly precise materials offer tunable combinations of useful properties.