Interaction integrals for thermal fracture of functionally graded piezoelectric materials
Interaction integrals for thermal fracture of functionally graded piezoelectric materials
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DOI：
10.1016/j.engfracmech.2009.09.009
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发表时间：
2010
影响因子：
5.4
通讯作者：
B. Rao;M. Kuna
中科院分区：
文献类型：
--
作者：
B. Rao;M. Kuna
本文提出了基于三个独立公式的相互作用积分的域形式，用于计算稳态热载荷作用下功能梯度压电材料裂纹的应力强度因子和电位移强度因子。每个配方不同的方式施加辅助领域的相互作用积分的评价和他们中的每一个结果在一个一致的形式的相互作用积分的意义上，额外的条款自然出现在他们的推导，以补偿在所选择的裂纹尖端渐近场的均匀和功能梯度压电介质的差异。
This paper presents domain form of the interaction integrals based on three independent formulations for computation of the stress intensity factors and electric displacement intensity factor for cracks in functionally graded piezoelectric materials subjected to steady-state thermal loading. Each of the formulation differs in the way auxiliary fields are imposed in the evaluation of interaction integral and each of them results in a consistent form of the interaction integral in the sense that extra terms naturally appear in their derivation to compensate for the difference in the chosen crack tip asymptotic fields of homogeneous and functionally graded piezoelectric medium.