Joining of silicon nitride via a transient liquid
Joining of silicon nitride via a transient liquid
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DOI：
10.1016/s1359-6462(97)00007-9
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发表时间：
1997-05
影响因子：
6
通讯作者：
M. Paulasto;G. Ceccone;S. Peteves
中科院分区：
文献类型：
--
作者：
M. Paulasto;G. Ceccone;S. Peteves
广泛使用的陶瓷材料直接接合方法，反应性金属钎焊和固态扩散接合，具有局限性，特别是当用于生产能够承受高操作温度的SisNs接头时，前一种途径。提出的在不同材料之间产生耐高温界面的替代方法是部分瞬时液相（PTLP）接合（1）。瞬态液相（TLP）方法（2）的这种改进使用多层金属，该多层金属由耐火金属（3）的厚芯上的薄插入物外层组成。在接合温度下形成液体，或者是因为已经超过外层的熔点，或者是因为芯和外层之间的反应已经产生在该温度下熔融的相。液体润湿固体表面并与母体材料相互扩散以转化成更难熔的固体材料。在键合或随后的热处理过程中外层的均匀化使得可以产生操作温度接近或等于接合时所用温度的接头。最近研究了S & N4与NiCr/Au和NiCr/Cu中间层的PTLP键合（4）。在本研究中，氮化硅连接到氮化硅使用多层插入CuTi/Pd/CuTi和Ti/Cu/Ti。研究了这些组合在连接过程中形成瞬时液体的能力，因此研究了它们对SisN 4的PTLP键合的适用性。在室温和高达800 ℃的高温下测定接头的弯曲强度。利用SEM/EDX/EPMA等技术对接头的微观组织和断口进行了观察和分析。
The widely used direct bonding methods for ceramic materials, reactive metal brazing and solid-state diffusion bondmg, have limitations, in particular the former route when used to produce SisNs joints able to withstand high operation temperatures. An alternative method proposed of creating high temperature resistant interfaces between dissimilar materials is partial transient liquid phase (PTLP) bonding (1). This modification of the transient liquid phase (TLP) method (2) use a multilayer metal composed of a thin insert outer layer on a thick core of refractory metal (3). A liquid is formed at the joining temperature either because the melting point of the outer layer has been exceeded or because reaction between the core and the outer layer has produced a phase that is molten at temperature. The liquid wets the solid surfaces and interdiffuses with the parent materials to transform into a more refractory solid material. Homogenisation of the outer layer during bonding or subsequent thermal treatment makes it possible to produce joints with operation temperatures near or equal to that used in joining.PTLP-bonding of S&N4 with NiCr/Au and NiCr/Cu interlayers has been investigated recently (4). In the present study silicon nitride was joined to silicon nitride using multilayer inserts CuTi/Pd/CuTi iand Ti/Cu/Ti. The ability of these combinations to form a transient liquid during joining and therefore their applicability for PTLP-bonding of SisN4 was studied. Flexural strengths of joints were determined at room temperature and at elevated temperatures up to 800 C. The joint microstructures and fracture surfaces were examined optically and with SEM/EDX/EPMA techniques.