Instant tough bonding of hydrogels for soft machines and electronics.

Instant tough bonding of hydrogels for soft machines and electronics.
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DOI:
10.1126/sciadv.1700053
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发表时间:
2017-06
期刊:
影响因子:
13.6
通讯作者:
Kaltenbrunner M
Kaltenbrunner M
中科院分区:
综合性期刊1区
文献类型:
--
作者:
Wirthl D;Pichler R;Drack M;Kettlguber G;Moser R;Gerstmayr R;Hartmann F;Bradt E;Kaltseis R;Siket CM;Schausberger SE;Hild S;Bauer S;Kaltenbrunner M

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A strategy for bonding water-rich hydrogels to diverse materials for electronic skins, energy storage, and soft optics is reported. Introducing methods for instant tough bonding between hydrogels and antagonistic materials—from soft to hard—allows us to demonstrate elastic yet tough biomimetic devices and machines with a high level of complexity. Tough hydrogels strongly attach, within seconds, to plastics, elastomers, leather, bone, and metals, reaching unprecedented interfacial toughness exceeding 2000 J/m2. Healing of severed ionic hydrogel conductors becomes feasible and restores function instantly. Soft, transparent multilayered hybrids of elastomers and ionic hydrogels endure biaxial strain with more than 2000% increase in area, facilitating soft transducers, generators, and adaptive lenses. We demonstrate soft electronic devices, from stretchable batteries, self-powered compliant circuits, and autonomous electronic skin for triggered drug delivery. Our approach is applicable in rapid prototyping and in delicate environments inaccessible for extended curing and cross-linking.