Linked Heat Treatment and Bending Simulation of Aluminium Tailored Heat Treated Profiles
Linked Heat Treatment and Bending Simulation of Aluminium Tailored Heat Treated Profiles
复制标题
铝定制热处理型材的关联热处理和弯曲模拟
DOI:
10.1007/978-3-319-57864-4_22
复制
发表时间:
2017
期刊:
影响因子:
--
通讯作者:
Fröck
中科院分区:
文献类型:
--
作者:
Fröck
Precipitation hardening aluminium alloys enable tailoring of mechanical properties through the dissolution of strength-increasing precipitates during a local short-term heat treatment. Tailor Heat Treated Profiles (THTP) are aluminium extrusion profiles with locally different material properties, specifically optimised for succeeding bending processes. Softened areas need to be generated next to hardened areas to optimise the material flow during the forming process. To determine the optimised layout of softened and hardened areas, a process chain simulation consisting of the simulation of the short-term heat treatment and the subsequent forming process seems purposeful. The numerical modelling of short-term heat treatment requires a coupled computation of thermal and mechanical simulation with particular focus on the evaluation of microstructure and consequently on the change of mechanical properties. The dissolution and precipitation behaviour during heating and cooling of aluminium profiles 6060 T4 is investigated using differential scanning calorimetry. Thermo-mechanical analysis is applied for evaluation of the mechanical properties. This behaviour should be described in a material model with the software LS DYNA. The heat treatment simulation provides a distribution of mechanical properties along the profile, which is an important input parameter for the following forming simulation. In order to avoid a loss of information between the heat treatment simulation and forming simulation, both linked simulations are performed with the software LS DYNA.
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DOI:
10.4028/www.scientific.net/msf.217-222.815
发表时间:
1996
期刊:
Materials Science Forum
影响因子:
--
作者:
M. Takeda;F. Ohkubo;T. Shirai;K. Fukui
通讯作者:
K. Fukui
影响因子:
1.1
作者:
M. Reich;O. Kessler
通讯作者:
O. Kessler
影响因子:
1.2
作者:
SeongNyeong Kim;Jaehwan Kim;H. Tezuka;E. Kobayashi;Tatsuo Sato
通讯作者:
Tatsuo Sato
影响因子:
1.7
作者:
Graser, Matthias;Froeck, Hannes;Merklein, Marion
通讯作者:
Merklein, Marion
DOI:
10.4028/www.scientific.net/msf.877.400
发表时间:
2017
期刊:
Materials Science Forum
影响因子:
--
作者:
Fröck
通讯作者:
Fröck