Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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DOI：
10.1115/1.4035387
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发表时间：
2017-03
影响因子：
1.6
通讯作者：
Mohamed H. Nasr;C. Green;P. Kottke;Xuchen Zhang;Thomas E. Sarvey;Y. Joshi;M. Bakir;A. Fedorov
中科院分区：
文献类型：
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作者：
Mohamed H. Nasr;C. Green;P. Kottke;Xuchen Zhang;Thomas E. Sarvey;Y. Joshi;M. Bakir;A. Fedorov
随着下一代电子产品集成度的提高，高功率密度器件变得更容易受到热点形成的影响，这通常会对性能造成热限制。作为热点热管理的解决方案，研究了两种微隙散热器结构下R134a的流动沸腾：隙高均为10μm的裸微隙和嵌套微针翅片的微隙在热源处的散热能力接近5 kW/cm2。研究的其他参数包括在进口压力高达1.5 MPa时高达3000 kg/m2s的质量通量和接近统一的出口质量。所研究的微间隙试验台由一个硅层组成，该硅层使用电阻加热器从底部加热，并加盖玻璃，以便直观观察两相流状态。壁面温度、装置热阻和压降结果被呈现出来，并映射到在微间隙中观察到的主要流动状态。
As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two microgap heat sink configurations was investigated as a solution for hotspot thermal management: a bare microgap and inline micro-pin fin populated microgap, both with 10μm gap height, were tested in terms of their ability to dissipate heat fluxes approaching 5 kW/cm2at the heat source. Additional parameters investigated include mass fluxes up to 3000 kg/m2s at inlet pressures up to 1.5 MPa and exit qualities approaching unity. The microgap testbeds investigated consist of a silicon layer which is heated from the bottom using resistive heaters and capped with glass to enable visual observation of two-phase flow regimes. Wall temperature, device thermal resistance, and pressure drop results are presented and mapped to the dominant flow regimes that were observed in the microgap.