Microwave Characterization of Copper-Clad Dielectric Laminate Substrates
Microwave Characterization of Copper-Clad Dielectric Laminate Substrates
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覆铜电介质层压基板的微波表征
DOI：
10.1093/ietele/e90-c.12.2178
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
Yoshio Kobayashi
中科院分区：
文献类型：
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作者：
Yoshio Kobayashi
为了实现更精确的平面电路设计，综述了表征覆铜介质层压板基板所必需的微波测量方法：即，对于法向方向上的相对复介电常数ε rn和tan δ n的平衡型圆盘谐振器方法，对于切向方向上的相对复介电常数ε rt和tan δ t的空腔谐振器方法和截止波导方法，用介质谐振器法测定了铜箔的表面和界面电导率σ s和σ i。测量结果的频率和温度依赖性的这些参数的PTFE基板和覆铜玻璃布PTFE层压板基板。
Microwave measurement methods necessary to characterize copper-clad dielectric laminate substrates are reviewed to realize more precise design of planar circuits: that is, the balanced-type circular disk resonator method for the relative complex permittivity in the normal direction e rn and tan δ n , the cavity resonator method and the cut-off waveguide method for one in the tangential direction e rt and tan δ t , and the dielectric resonator method for the surface and interface conductivity of copper foil σ s and σ ι . The measured results of the frequency and temperature dependences of these parameters are presented for a PTFE substrate and a copper-clad glass cloth PTFE laminate substrate.