Effect of Atmospheric Pressure Plasma Treatment on the Lap-Shear Strength of Adhesive-Bonded Sheet Molding Compound Joints
Effect of Atmospheric Pressure Plasma Treatment on the Lap-Shear Strength of Adhesive-Bonded Sheet Molding Compound Joints
复制标题
大气压等离子体处理对胶粘片状模塑料接头搭接剪切强度的影响
DOI：
10.1007/s42154-018-0027-7
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发表时间：
2018-07
影响因子：
6.1
通讯作者：
Shanglu Yang
中科院分区：
文献类型：
--
作者：
Shuang Wang;Junying Min;Jianping Lin;Chengcheng Sun;Shanglu Yang
采用常压等离子体处理（APPT）技术对SMC基材进行处理，以提高SMC粘接接头的搭接剪切强度。此外，本文还探讨了appt处理的胶粘剂粘合SMC接头的搭接剪切强度提高的机制。当APPT距离设置为20 mm时，最大搭剪强度约为接收SMC节点的3倍。表面粗糙度对搭接抗剪强度影响不大，并不是导致搭接抗剪强度增加的主要原因。具体而言，x射线光电子能谱显示，APPT后含O基团（即C-O-H、C-O-C、H-O-C =O或R-O-C =O）的增加有助于提高搭剪强度。此外，APPT后表面自由能显著增加，提高了胶粘剂粘合SMC接头的搭接剪切强度。与表面形貌的变化相比，表面化学性质和表面自由能的变化对提高appt处理SMC接头的搭剪强度的作用更大。
Atmospheric pressure plasma treatment (APPT) technology was used herein to treat sheet molding compound (SMC) substrates to increase the lap-shear strength of adhesive-bonded SMC joints. Further, the mechanisms behind the lap-shear strength improvements in APPT-treated adhesive-bonded SMC joints were explored. A maximum lap-shear strength about three times that of the as-received SMC joints was achieved when the APPT distance was set to 20 mm. The surface roughness, which exhibited little benefit to the lap-shear strength, was determined to not be the primary reason for the increase in lap-shear strength. Specifically, X-ray photoelectron spectra revealed that an increased amount of O-containing groups (i.e., C–O–H, C–O–C, H–O–C=O or R–O–C=O) following APPT contributed to the improved lap-shear strength. In addition, the surface free energy increased significantly after APPT, which improved the lap-shear strength of the adhesive-bonded SMC joints. Compared to the change of surface morphology, the changes in both the surface chemical property and surface free energy played larger roles in increasing the lap-shear strength of APPT-treated SMC joints.
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通过常压等离子体处理提高碳纤维对聚酰亚胺的粘合力
影响因子：
5.4
作者：
Xie, Jianfei;Xin, Danwei;Cao, Hongyan;Wang, Cuntao;Zhao, Yi;Yao, Lan;Ji, Feng;Qiu, Yiping
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影响因子：
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作者：
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DOI：
10.1002/jbm.b.33284
发表时间：
2015-07
期刊：
Journal of biomedical materials research. Part B, Applied biomaterials
影响因子：
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作者：
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DOI：
10.1016/j.ijadhadh.2012.04.007
发表时间：
2012-10-01
影响因子：
3.4
作者：
Baldan, A.
通讯作者：
Baldan, A.