Enhanced adhesion of polypropylene to copper substrates
Enhanced adhesion of polypropylene to copper substrates
复制标题
增强聚丙烯对铜基材的附着力
DOI：
10.1016/j.polymertesting.2017.05.017
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发表时间：
2017
期刊：
影响因子：
5.1
通讯作者：
A. Srinivasan
中科院分区：
文献类型：
--
作者：
W. Brostow;I. Chen;N. Hnatchuk;J. Hrbacek;Andrew Hull;R. Pahler;A. Srinivasan
在过氧化二异丙苯（DCP）存在下，将不同浓度的马来酸酐（MAH）接枝到三种聚丙烯（PP）上。从铜基材的剥离粘合强度，拉伸杨氏模量，和拉伸断裂应变进行了测定和SEM观察作为每一个PP的MAH浓度的函数。PP之一加上3重量%的MAH提供了高值的粘合强度沿着杨氏模量和断裂应变，足以用作铜线和电缆的涂层。
Varying concentrations of maleic anhydride (MAH) were grafted onto three types of polypropylene (PP) in the presence of dicumyl peroxide (DCP). Pull-off adhesive strength from a copper substrate, tensile Young's modulus, and tensile strain-at-break were determined and SEM observations made as a function of the MAH concentration for each PP. One of the PPs plus 3 wt% MAH provides a high value of the adhesive strength along with the Young modulus and the strain-at-break sufficient for the use as a coating for copper wires and cables.