Neuromorphic vision chip fabricated using three-dimensional integration technology

Neuromorphic vision chip fabricated using three-dimensional integration technology
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DOI:
10.1109/isscc.2001.912633
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发表时间:
2001-02
期刊:
2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177)
影响因子:
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通讯作者:
M. Koyanagi;Yoshihiro Nakagawa;K. W. Lee;T. Nakamura;Y. Yamada;K. Inamura;Ki-Tae Park;H. Kurino
M. Koyanagi;Yoshihiro Nakagawa;K. W. Lee;T. Nakamura;Y. Yamada;K. Inamura;Ki-Tae Park;H. Kurino
中科院分区:
其他
文献类型:
--
作者:
M. Koyanagi;Yoshihiro Nakagawa;K. W. Lee;T. Nakamura;Y. Yamada;K. Inamura;Ki-Tae Park;H. Kurino

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人脑中的信息处理是基于具有大量存储器和互连的高级并行处理。为了实现这种高度先进的并行处理,人脑具有分层结构的模块,即,三维结构作为基本处理单元。人的视网膜和视皮层也具有由各种细胞组成的分层结构。本文报道的三维(3D)集成技术利用硅实现了具有视网膜和视觉皮层部分功能的图像处理和模式识别系统。
Information processing in the human brain is based on advanced parallel processing with a large number of memories and interconnections. To achieve such highly advanced parallel processing, the human brain has modules with layered structures, that is, three-dimensional structures as basic processing units. The human retina and visual cortex also have layered structures with various kinds of cells. The three-dimensional (3D) integration technology reported here achieves an image processing and pattern recognition system with parts of functions of the retina and visual cortex using silicon.