MEMS reliability from a failure mechanisms perspective
MEMS reliability from a failure mechanisms perspective
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DOI：
10.1016/s0026-2714(03)00119-7
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发表时间：
2003-07-01
影响因子：
1.6
通讯作者：
van Spengen, WM
中科院分区：
文献类型：
--
作者：
van Spengen, WM
近年来，人们对微机电系统（MEMS）的失效机理和可靠性进行了大量的研究。虽然仍然非常不完整，但我们对与MEMS相关的可靠性问题的了解正在增长。本文概述了常见的MEMS失效机制。它侧重于微尺度器件的可靠性问题，但对于一些问题，也简要地触及了其宏观对应领域。本文讨论了MEMS中常用的结构、硅的粘滞、蠕变、疲劳、脆性疲劳、磨损、介电充电、击穿、污染和封装。(C) 2003 Elsevier Ltd.版权所有。
Over the last few years, considerable effort has gone into the study of the failure mechanisms and reliability of micro-electromechanical systems (MEMS). Although still very incomplete, our knowledge of the reliability issues relevant to MEMS is growing. This paper provides an overview of MEMS failure mechanisms that are commonly encountered. It focuses on the reliability issues of micro-scale devices, but, for some issues, the field of their macroscopic counterparts is also briefly touched. The paper discusses generic structures used in MEMS, stiction, creep, fatigue, brittle fatigue in silicon, wear, dielectric charging, breakdown, contamination and packaging. (C) 2003 Elsevier Ltd. All rights reserved.