Submicron-scale depth profiling of residual stress in amorphous materials by incremental focused ion beam slotting
Submicron-scale depth profiling of residual stress in amorphous materials by incremental focused ion beam slotting
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DOI：
10.1016/j.actamat.2011.12.035
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发表时间：
2012-03-01
期刊：
影响因子：
9.4
通讯作者：
Withers, P. J.
中科院分区：
文献类型：
--
作者：
Winiarski, B.;Gholinia, A.;Withers, P. J.
This paper reports a new technique, namely the incremental micro-slotting cutting method, for the investigation of residual stress profiles as a function of depth on a micron scale. The residual-stresses in a peened bulk-metallic glass (BMG) (Zr50Cu40Al10, in atomic per cent) are estimated using finite-clement analysis of the surface relaxations, as measured by digital image correlation analysis from field-emission gun scanning electron microscopy images, which occur when a micro-slot is stepwise micro-machined by focused ion beam. The calculation algorithm, which solves this inverse problem of residual-stress estimation, is based on the unit pulses method and is stabilized by a Tikhonov regularization scheme. It is demonstrated on a peened BMG that the new technique allows residual-stress profiles in amorphous materials to be inferred with high spatial definition (similar to 400 nm). Observations point to the scalability of this method to study residual-stress profiles in volumes as small as 1 x 1 x 0.2 mu m(3) or less, and is particularly well suited to glasses, but can also be applied to crystalline materials. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
