Waterjet and laser etching: the nonlinear inverse problem.
Waterjet and laser etching: the nonlinear inverse problem.
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DOI：
10.1098/rsos.161031
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发表时间：
2017-07
影响因子：
3.5
通讯作者：
Cadot GBJ
中科院分区：
文献类型：
--
作者：
Bilbao-Guillerna A;Axinte DA;Billingham J;Cadot GBJ
在水射流和激光铣削中，材料以连续的层从固体表面去除，以深度控制的方式创建新的形状。逆问题包括定义控制参数，特别是二维光束路径，以达到规定的自由曲面。本文研究了水射流铣削（WJM）和脉冲激光烧蚀（PLA），因为通用的非线性材料去除模型适用于这两个过程。对于这种工艺，通常通过简单地控制停留时间与在表面上的一系列像素处的所需铣削深度成比例来解决逆问题。然而，这种方法仅在蚀刻浅表面时有效，因为它没有考虑光束的覆盖区或其在连续通过上的重叠。本文提出了一种离散伴随算法来改进该算法。优化中包括非线性效应和非直道次，而雅可比矩阵的计算不需要大量的计算时间。几个测试进行验证所提出的方法和结果表明，跟踪误差通常减少了两个因素相比，像素的像素的方法和经典的光栅路径策略与直线通过。根据目标表面的复杂性，WJM和PLA的跟踪误差分别可以低至2-5%和1-2%。
In waterjet and laser milling, material is removed from a solid surface in a succession of layers to create a new shape, in a depth-controlled manner. The inverse problem consists of defining the control parameters, in particular, the two-dimensional beam path, to arrive at a prescribed freeform surface. Waterjet milling (WJM) and pulsed laser ablation (PLA) are studied in this paper, since a generic nonlinear material removal model is appropriate for both of these processes. The inverse problem is usually solved for this kind of process by simply controlling dwell time in proportion to the required depth of milling at a sequence of pixels on the surface. However, this approach is only valid when shallow surfaces are etched, since it does not take into account either the footprint of the beam or its overlapping on successive passes. A discrete adjoint algorithm is proposed in this paper to improve the solution. Nonlinear effects and non-straight passes are included in the optimization, while the calculation of the Jacobian matrix does not require large computation times. Several tests are performed to validate the proposed method and the results show that tracking error is reduced typically by a factor of two in comparison to the pixel-by-pixel approach and the classical raster path strategy with straight passes. The tracking error can be as low as 2–5% and 1–2% for WJM and PLA, respectively, depending on the complexity of the target surface.
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