Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering

Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering
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用于常温烧结的银铜合金纳米油墨

DOI:
10.1021/acs.langmuir.2c00221
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发表时间:
2022
期刊:
影响因子:
3.9
通讯作者:
Zhong, Chuan-Jian
Zhong, Chuan-Jian
中科院分区:
化学2区
文献类型:
--
作者:
Robinson, Richard;Krause, Virginia;Wang, Shan;Yan, Shan;Shang, Guojun;Gordon, Justine;Tycko, Serena;Zhong, Chuan-Jian

文献摘要

相似文献

人们越来越需要降低银基油墨或浆料中的银含量,并实现低温烧结,以实现可扩展和低成本的印刷可穿戴电子产品的生产。这一需求取决于控制纳米油墨的金属成分和表面性质的能力。银与铜的合金化为降低成本提供了一条满足需求的途径,但对其成分可控性和低温烧结能力知之甚少。本文报道了一种可扩展的具有室温烧结性能的双金属银-铜合金纳米墨水的湿化学合成方法。组成可控的双金属合金纳米颗粒可制成稳定的纳米油墨。打印在纸基材上的纳米油墨可以在室温下烧结。除了成分依赖,结果还揭示了有趣的烧结依赖于印刷的纳米墨水薄膜上方的湿度。这些发现是基于通过表面介电烧结和颗粒间颈缩机制的纳米级吸附、附着和扩散以及表面自由能的烧结过程的理论模拟来评估的。文中还讨论了这些发现对可穿戴传感器的室温制造的影响。
There is an increasing need to reduce the silver content in silver-based inks or pastes and achieve low-temperature sintering for scalable and low-cost production of printed wearable electronics. This need depends on the ability to control the metal composition and the surface properties of the nanoinks. Alloying silver with copper provides a pathway for meeting the need in terms of cost reduction, but little is known about the composition controllability and the low-temperature sintering capability. We report herein a scalable wet chemical synthesis of bimetallic silver–copper alloy nanoinks with room temperature sintering properties. The bimetallic alloy nanoparticles with a controllable composition can be formulated as stable nanoinks. The nanoinks printed on paper substrates are shown to sinter under room temperature. In addition to composition dependence, the results reveal an intriguing dependence of sintering on humidity above the printed nanoink films. These findings are assessed based on theoretical simulation of the sintering processes via surface-mediated sintering and interparticle necking mechanisms in terms of nanoscale adsorption, adhesion and diffusion, and surface free energies. Implications of the findings for room temperature fabrication of wearable sensors are also discussed.