Static Globularization of TC11 Alloy during Hot Working Process
Static Globularization of TC11 Alloy during Hot Working Process
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DOI：
10.1016/s1875-5372(11)60038-6
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发表时间：
2011-06-01
影响因子：
0.7
通讯作者：
Cao Chunxiao
中科院分区：
文献类型：
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作者：
Chen Huiqin;Cao Chunxiao
研究了在温度980~850℃、应变速率0.001.0 1、0.0 1和0.1 S(-1)条件下变形的片层结构TC11合金的组织演变，以及在不同温度下退火后的静态组织演变和机制。结果表明，在较高变形量、较高温度和较低应变速率下的动态再结晶过程基本完成，退火组织的球化程度主要取决于变形过程中的动态再结晶。但在较低变形量、较低温度和较高应变速率下，动态再结晶过程受到抑制，退火组织的球化程度既取决于变形状态，也取决于静态再结晶过程，α晶粒度主要取决于退火温度和保温时间。动态和静态球化组织的EBSD测试表明，静态球化的机制包括β相的静态再结晶和α相的静态回复，以及随后的球化和粗化。
The microstructure evolution of TC11 alloy with lamellar structures deformed at temperatures of 980-850 degrees C and strain rates of 0.001, 0.01 and 0.1 s(-1), and the static structure evolution and mechanism of the alloy annealed at different temperatures were investigated. The results show that dynamic recrystallization process at higher reduction, higher temperature and lower strain rate is almost complete, and the globularized fraction of the annealed microstructure mainly depends on the dynamic recrystallization during deformation. But the dynamic recrystallization process at lower reduction, lower temperature and higher strain rate is restrained, and the globularized fraction of the annealed structure depends on both of the deformation state and the static recrystallization process during annealing, alpha-grain size mainly depends on annealing temperature and holding time mainly. EBSD tests of dynamic and static globularized microstructures show that the mechanism of static globularization during annealing involves the static recrystallization of beta-phase and the static recovery of alpha-phase, and subsequent globularization and coarsening.