THE INTERACTION OF THIN NIO LAYERS WITH SINGLE-CRYSTALLINE ALPHA-AL2O3(11(2)OVER-BAR0) SUBSTRATES
THE INTERACTION OF THIN NIO LAYERS WITH SINGLE-CRYSTALLINE ALPHA-AL2O3(11(2)OVER-BAR0) SUBSTRATES
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DOI:
10.1016/0039-6028(95)00063-1
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发表时间:
1995-05-20
期刊:
影响因子:
1.9
通讯作者:
HABRAKEN, FHPM
中科院分区:
文献类型:
--
作者:
BOLT, PH;TENGROTENHUIS, E;HABRAKEN, FHPM
In order to investigate the interfacial reaction between NiO and alpha-Al2O3 to NiAl2O4 at monolayer level, thin Ni layers (4-29 x 10(15) atoms/cm(2) Ni) were vapour-deposited onto Al2O3(11 (2) over bar 0) substrates and subsequently annealed in O-2 at temperatures ranging from 400 to 1100 degrees C. The samples were subsequently analyzed by high energy ion channeling, X-ray photoelectron spectroscopy and atomic force microscopy. From ion channeling analysis it is deduced that formation of bulk NiAl2O4 does not occur at temperatures up to 950 degrees C. Due to sintering of NiO quite large nickel oxide particles (maximum height about 50 nm) were observed by AFM after annealing at 900 degrees C in O-2. Considerably smaller particles were observed after annealing at 1000 degrees C, and almost no particles were found on the sample kept at 1100 degrees C. These findings are consistent with the XPS results. At 1000 degrees C and higher temperatures, the rate of the solid state reaction to NiAl2O4 is apparently comparable to or higher than the rate of NiO-island formation. Furthermore, several indications for the formation of some Ni-Al-O precursor compound at the interface below the onset temperature of the reaction to NiAl2O4 are discussed.