Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration
Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration
复制标题
β-Sn 扩散各向异性在 Sn-3.0Ag-0.5Cu 倒装芯片凸块电迁移微观结构演变中的作用
作者：
Huang, M. L.;Zhao, J. F.;Zhang, Z. J.;Zhao, N.
