Mode I type interlaminar fracture toughness of Cu plated Gd-YBCO coated conductor
Mode I type interlaminar fracture toughness of Cu plated Gd-YBCO coated conductor
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DOI：
10.1016/j.phpro.2012.03.458
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
M. Hojo;Y. Tanie;M. Sugano;Y. Inoue;M. Nishikawa;K. Shikimachi;Tomonori Watanabe;N. Hirano;S. Nagaya
中科院分区：
文献类型：
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作者：
M. Hojo;Y. Tanie;M. Sugano;Y. Inoue;M. Nishikawa;K. Shikimachi;Tomonori Watanabe;N. Hirano;S. Nagaya
使用 DCB（双悬臂梁）样品进行 I 型断裂韧性测试，用于新开发的带有改性缓冲层的 Gd-YBCO 涂层导体，以定量表征抗分层性能。断裂韧性值约为5至10J/m2。分层表面的EDS、XPS和AES分析表明，层状结构的断裂位置分为以下两部分： Gd-YBCO 层和 GZO/Hastelloy 界面。由于分层位置位于相当脆的部件内，因此这种 Gd-YBCO 涂层导体的分层韧性相当低。
The mode I type fracture toughness tests using DCB (Double Cantilever Beam) specimens were applied for a newly developed Gd- YBCO coated conductor with modified buffer layers in order to quantitatively characterize the delamination resistance. The fracture toughness values were about 5 to 10J/m2. EDS, XPS and AES analyses of the delaminated surface showed that the fracture location of the layered structure was categorized as the following two parts; Gd-YBCO layer and GZO/Hastelloy interface. Since the delamination locations were localized within rather brittle components, the delamination toughness of this Gd-YBCO coated conductor was rather low.