Glass cutting by femtosecond pulsed irradiation
Glass cutting by femtosecond pulsed irradiation
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DOI：
10.1117/1.1668274
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发表时间：
2004-04-01
期刊：
影响因子：
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通讯作者：
Misawa, H
中科院分区：
文献类型：
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作者：
Vanagas, E;Kawai, J;Misawa, H
我们报告的石英和玻璃切割的飞秒脉冲（150 fs，1 kHz的重复率）的800 nm波长的横向扫描，在室内和低压（5托）的空气环境。脉冲由低数值孔径（NA小于或等于0.1）物镜透镜聚焦。优化的制造条件：脉冲能量和扫描速度进行，以实现大规模（毫米至厘米）切割的亚微米尺寸的微裂纹沿着的边缘和壁的削减。成功地切出了0.1-0.5 mm厚的样品，没有明显的热影响区。在低气压（5托）的气氛中，烧蚀材料的再沉积大大减少。结果表明，等离子体烧蚀压力脉冲产生的应力波是导致后表面损伤的主要原因。讨论了高辐照度飞秒激光切割透明材料的机理以及等离子体羽流产生的应力波对切割的影响。(C)2004年，美国光电仪器工程师学会。
We report on quartz and glass cutting by a lateral scanning of femtosecond pulses (150 fs at 1 kHz repetition rate) of 800 nm wavelength at room and low pressure (5 Torr) air ambience. Pulses were focused by a low numerical aperture (NAless than or equal to0.1) objective lens. Optimization of fabrication conditions: pulse energy and scanning speed were carried out to achieve large-scale (millimeter-to-centimeter) cutting free of microcracks of submicron dimensions along the edges and walls of the cut. Cutting through out the samples of 0.1-0.5 mm thickness was successfully achieved without apparent heat affected zone. At low air pressure (5 Torr) ambience, redeposition of ablated material was considerably reduced. It is demonstrated that the damage on the rear surface was induced by the stress waves, which originated from the plasma ablation pressure pulse. The mechanism of femtosecond-laser cutting of transparent materials at high irradiance and the influence of stress waves generated by plasma plume are discussed. (C) 2004 Society of Photo-Optical Instrumentation Engineers.