The dynamics of the CMP discovery for device applications in IBM
The dynamics of the CMP discovery for device applications in IBM
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IBM 设备应用程序 CMP 发现的动态
DOI：
10.11470/oubutsu.90.2_119
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
K. D. Beyer
中科院分区：
文献类型：
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作者：
K. D. Beyer
1968年，我被IBM聘为化学家，在掺杂氧化物扩散、材料应力、杂质吸除和硅片清洁等指定主题上工作了八年。在接下来的五年里，我是计算机芯片可靠性小组的一员。在那里，我了解到硅片产量取决于颗粒和流动离子污染的减少。
In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.