An 86% Efficiency, 20MHz, 3D-Integrated Buck Converter with Magnetic Core Inductor Embedded in Interposer Fabricated by Epoxy/Magnetic-Filler Composite Build-Up Sheet
An 86% Efficiency, 20MHz, 3D-Integrated Buck Converter with Magnetic Core Inductor Embedded in Interposer Fabricated by Epoxy/Magnetic-Filler Composite Build-Up Sheet
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An%2086%%20效率，%2020MHz，%203D-集成%20Buck%20转换器%20with%20Magnetic%20Core%20Inductor%20Embedded%20in%20Interposer%20Fabricated%20by%20Epoxy/Magnetic-Filler%20Composite%20Build-Up%20Sheet
DOI：
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发表时间：
2019
期刊：
影响因子：
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通讯作者：
K. Miyaji
中科院分区：
文献类型：
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作者：
Takanobu Fukuoka;Yuki Karasawa;T. Akiyama;R. Oka;S. Ishida;T. Shirasawa;M. Sonehara;Toshiro Sato;K. Miyaji
本文提出了一种三维集成降压变换器，实现在嵌入磁芯电感的中间体上。该转换器采用积层工艺，实现了占地面积小、制造成本低、效率高、负载瞬态响应快等特点。在本文提出的中间体堆积层合工艺中，使用环氧树脂/磁性填料复合片在堆积层内形成全封闭磁路螺旋电感，而无需使用任何昂贵的磁性薄膜沉积工艺。此外，采用0.35μm标准CMOS工艺，提出并设计了适合高开关频率工作的控制芯片。利用这些技术，所提出的3d集成降压转换器在16/20MHz开关频率下，在5V到3.3V的电压转换下，效率最高可达87.0/86.0%。负载阶跃在80mA ~ 460mA之间，负载瞬态响应小于2.6µs。
This paper presents a three-dimensional (3D) -integrated buck converter implemented on an interposer with an embedded magnetic core inductor. The converter realizes small footprint, low fabrication cost, high efficiency, and fast load transient response by using the proposed build-up lamination process. In the proposed interposer build-up lamination process, epoxy/magnetic-filler composite sheet is used to form a fully closed magnetic circuit spiral inductor inside the build-up layer without using any expensive magnetic thin film deposition process. Furthermore, a control chip suitable for high switching frequency operation is proposed and designed by a 0.35μm standard CMOS process. With these proposed technologies, the proposed 3D-integrated buck converter shows maximum efficiency of 87.0/86.0% at 16/20MHz switching frequency with a voltage conversion of 5V to 3.3V. The load transient response is less than 2.6µs at the load step between 80mA and 460mA.