Study on heat transfer performance for loop heat pipe with circular flat evaporator
Study on heat transfer performance for loop heat pipe with circular flat evaporator
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DOI：
10.1016/j.ijheatmasstransfer.2011.09.010
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发表时间：
2012-01
影响因子：
5.2
通讯作者：
X. Nguyen;B. Sung;Jeehoon Choi;S. Ryoo;H. Ko;Chul-ju Kim
中科院分区：
文献类型：
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作者：
X. Nguyen;B. Sung;Jeehoon Choi;S. Ryoo;H. Ko;Chul-ju Kim
设计了一种用于电子器件冷却的环形平板热管。研制了外径41 mm、厚度15 mm的铜粉吸液芯平板蒸发器。开发的蒸发器进行了检查，以改善不足的过冷度的液体在补偿室，这降低了LHP的操作限制。在该系统的所有实验期间，还考虑了蒸发器的高度和方向的许多不同取向。有效加热面积为3cm×3cm，试验用水。该LHP产生超过140 W的热负荷，总热阻为0.39°C/W。
A loop heat pipe (LHP) with a circular flat evaporator was designed for cooling electronic devices. The flat evaporator with an outside diameter of 41mm and a thickness of 15mm was developed with a copper powder wick. The developed evaporator was examined to improve insufficient subcooling of liquid in a compensation chamber, which decreases an operating limitation of the LHP. Many different orientations of the elevation and direction of the evaporator were also considered during all of the experiments for this system. The active heating area was 3cm×3cm, and water was used in the tests. This LHP generated a heat load in excess of 140W with a total thermal resistance of 0.39°C/W.