Immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structures generate exceptional strength-conductivity and thermal stability combination in Cu-based composites
Immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structures generate exceptional strength-conductivity and thermal stability combination in Cu-based composites
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DOI：
10.1016/j.msea.2022.144228
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发表时间：
2022-10
期刊：
影响因子：
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通讯作者：
L. Zeng;L. Zeng;S. Miao;Xuehui Zhang;Weijiang Liu
中科院分区：
文献类型：
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作者：
L. Zeng;L. Zeng;S. Miao;Xuehui Zhang;Weijiang Liu
在铜基材料中同时实现高强度、高导电性和优异的热稳定性具有重要意义，但仍然是一个关键挑战，因为这些理想的性能往往表现出相互排斥的关系。本文提出了一种克服这种权衡困境的有效策略，即利用累积滚键合（ARB）技术在Cu基材料中构建非混相Cu/Ag/Cu/Nb纳米层状复合材料结构。由此产生的非混相Cu/Ag/Cu/Nb三元纳米层状结构，平均层状间距为20 nm，具有优异的性能组合：高抗拉强度超过1.0 GPa，具有超过80% IACS（国际退火铜标准）的优异导电性，同时在700°C下保持10小时的机械和热稳定性。这些理想的性能源于异常高密度的Cu/Ag和Cu/Nb异相界面，层内积累的低密度缺陷以及独特的不混相Cu/Ag/Cu/Nb纳米层状结构的协同作用。我们的研究结果表明，铜基材料的几个相互排斥的性能，包括强度-热稳定性和强度-电导率，同时得到了改善，从而为工程高性能纳米结构材料提供了一条有前途的途径。
It is of significance, but still remains a key challenge, to realize simultaneously high strength, high conductivity and excellent thermal stability in Cu-based materials, as these desirable properties often display a mutually exclusive relationship with each other. Here we propose an effective strategy to overcome this trade-off dilemma by constructing an immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar composite structure in Cu-based materials using accumulative roll bonding (ARB) technique. The resultant immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar structure with an average lamellar spacing of 20 nm produces an exceptional property combination: high tensile strength exceeding 1.0 GPa combined with excellent electrical conductivity above 80% IACS (International Annealed Cu Standard), while maintaining mechanical and thermal stability up to 700 °C for 10h. These desirable properties originate from the synergistic contributions from the unusually high density of immiscible Cu/Ag and Cu/Nb heterophase interfaces, the low density of defects accumulated within the layers and the unique immiscible tri-phase Cu/Ag/Cu/Nb nanolamellar structure. Our results demonstrate the concurrent improvement of several mutually exclusive properties in Cu-based materials including strength-thermal stability, and strength-electrical conductivity, and thus represent a promising route to engineering high performance nanostructured materials.