A NEW APPROACH TO MODELING THE CURE KINETICS OF EPOXY AMINE THERMOSETTING RESINS .1. MATHEMATICAL DEVELOPMENT
A NEW APPROACH TO MODELING THE CURE KINETICS OF EPOXY AMINE THERMOSETTING RESINS .1. MATHEMATICAL DEVELOPMENT
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DOI：
10.1021/ma00011a011
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发表时间：
1991-05-27
期刊：
影响因子：
5.5
通讯作者：
COLE, KC
中科院分区：
文献类型：
--
作者：
COLE, KC
Horie模型用于描述环氧胺体系的固化动力学扩展到明确包括醚化反应，这变得显着时，有一个相对于胺的环氧树脂过量，当固化是在较高的温度下进行。 推导出动力学方程的解，使得可以确定转化度α和转化率d-α/dt之间的关系。 醚化反应的不同可能的机制被认为是。 该模型可用于计算反应中形成的不同基团的量，从而提供有关网络结构的信息。
The Horie model for describing the cure kinetics of epoxy amine systems is extended to explicitly include the etherification reaction, which becomes significant when there is an excess of epoxy with respect to amine and when the cure is performed at higher temperatures. A solution to the kinetic equations is derived that makes it possible to determine the relationship between the degree of conversion alpha and the rate of conversion d-alpha/dt. Different possible mechanisms for the etherification reaction are considered. The model can be used to calculate the amounts of different groups formed in the reaction and hence provide information concerning the network structure.