Hydrogen permeation behavior through tungsten deposition layer

Hydrogen permeation behavior through tungsten deposition layer
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DOI:
10.1016/j.fusengdes.2020.112083
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发表时间:
2020-11
影响因子:
1.7
通讯作者:
Hideki Ito;K. Katayama;D. Mori;Y. Hara;M. Oya
Hideki Ito;K. Katayama;D. Mori;Y. Hara;M. Oya
中科院分区:
工程技术3区
文献类型:
--
作者:
Hideki Ito;K. Katayama;D. Mori;Y. Hara;M. Oya

文献摘要

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从燃料控制和氚安全的角度来看,了解面向等离子体壁中的氢同位素行为是重要的。钨(W)是面向等离子体部件的候选材料。在这项研究中,氢等离子体溅射形成的W沉积层中的氢扩散系数和氢溶解度常数通过气体驱动渗透实验获得。氢在W沉积层中的扩散系数小于在体W中的扩散系数,而氢的溶解度常数大于在体W中的溶解度常数。然后,在77 ~ 145 °C的温度范围内,观察了通过氢等离子体溅射在镍板上生长的W沉积层的氢渗透行为。随着沉积层厚度的增加,氢渗透通量先急剧增加后逐渐减小。通过TMAP程序分析渗透行为,估算了沉积层表面的复合系数。得到的复合系数小于体W上的复合系数。
Understanding of hydrogen isotope behaviors in plasma-facing wall is important from viewpoints of fuel control and tritium safety. Tungsten (W) is a candidate material of plasma-facing components. In this study, hydrogen diffusion coefficient and hydrogen solubility constant in the W deposition layer formed by hydrogen plasma sputtering were obtained by gas-driven permeation experiments. The hydrogen diffusion coefficient in the W deposition layer was smaller than that in bulk W, and the hydrogen solubility constant was larger than that in bulk W. Then, hydrogen permeation behavior through the W deposition layer growing on nickel plate by hydrogen plasma sputtering was observed in the temperature range from 77 to 145 °C. Initially, the hydrogen permeation flux steeply increased but then gradually decreased with increasing the thickness of the deposition layer. From the analysis of the permeation behavior by TMAP code, the recombination coefficient on the surface of the deposition layer was evaluated. The obtained recombination coefficient was smaller than that on bulk W.