3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
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DOI：
10.1109/3dic.2009.5306588
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发表时间：
2009-10
期刊：
影响因子：
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通讯作者：
Yaoyao Ye;L. Duan;Jiang Xu;Ouyang Jin;M. K. Hung;Yuan Xie
中科院分区：
文献类型：
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作者：
Yaoyao Ye;L. Duan;Jiang Xu;Ouyang Jin;M. K. Hung;Yuan Xie
片上网络（NoC）正在成为多处理器片上系统（MPSoC）的关键片上通信架构。在传统的电子NoC中，通过增加并行金属线的数量可以以更多的能量消耗为代价来获得高带宽。因此，提出了光片上网络，以实现低功耗的超高带宽的数据传输在光域。电子控制技术可以作为光网络的补充。除了NoC之外，三维集成电路（3D IC）是通过减少互连长度来提高系统性能的另一个有吸引力的解决方案。使用3D IC作为实现混合技术电控光学NoC的平台的研究直到最近才得到解决。在本文中，我们提出了一个3D电子控制的光学NoC实现在TSV为基础的（通过硅通孔）的两层3D芯片。上器件层是光学层。它集成了一个光数据传输网络，负责光有效载荷分组的传输。底部器件层是电子层。它包含一个电子控制网络，用于路由控制数据包和配置光网络。我们建立了一个8×8网格的3D光学NoC，具有45 nm的电子控制网络。与匹配的2D电子NoC的功率比较表明，光学NoC可以显着降低功耗。对于2048B数据包，它具有70%的功率降低。在不同的注入速率下，两个NoC的端到端延迟（埃特延迟）和网络吞吐量进行了比较。结果表明，当网络拥塞时，光片上网络的埃特时延远小于电片上网络。以4096B数据包为例，在注入速率为0.5的光学NoC中为18.7µs，而在电子NoC中为33.5µs。使用32Gbps光链路带宽的光NoC可以提供478Gbps的最大吞吐量。由于电路交换的低资源利用率，光NoC的最大吞吐量略低于电NoC。
Networks-on-chip (NoC) is emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoC). In traditional electronic NoCs, high bandwidth can be obtained by increasing the number of parallel metallic wires at the cost of more energy consumption. Optical NoCs are thus proposed to achieve low-power ultra-high-bandwidth data transmission in optical domain. Electronic control technology could be a complement to the optical networks. Besides NoCs, three-dimensional integrated circuits (3D ICs) are another attractive solution for system performance improvement by reducing the interconnect length. The investigation of using 3D IC as a platform for the realization of mixed-technology electronic-controlled optical NoC has not been addressed until recently. In this paper, we propose a 3D electronic-controlled optical NoC implemented in a TSV-based (through-silicon via) two-layer 3D chip. The upper device layer is an optical layer. It integrates an optical data transmission network, which is responsible for optical payload packets transmission. The bottom device layer is an electronic layer. It contains an electronic control network, which is used to route control packets and configure the optical network. We built an 8×8 mesh-based 3D optical NoC, with a 45nm electronic control network. Power comparison with a matched 2D electronic NoC shows that the optical NoC can reduce power consumption significantly. For 2048B packets, it has a 70% power reduction. End-to-end delay (ETE delay) and network throughput of the two NoCs under varying injection rates were evaluated for comparison. The results show that ETE delay of the optical NoC is much smaller than the electronic NoC when the network becomes congested. Take 4096B packets for example, it is 18.7µs in the optical NoC with an injection rate of 0.5, while 33.5µs in the electronic one. A maximum throughput of 478Gbps can be offered by the optical NoC using 32Gbps optical link bandwidth. Because of the low resource utilization of circuit switching, the maximum throughput of the optical NoC is slightly lower than the electronic one.