Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates
Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates
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印刷电路板和金属化陶瓷基板上金属粗糙表面的薄层电阻和电导率测量
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
H. Koltuniak
中科院分区：
文献类型：
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作者：
J. Krupka;L. Usydus;H. Koltuniak
在覆铜层压板中，铜箔被粗化以提高绝缘树脂的粘附性。粗糙金属表面的薄层电阻随频率的增加而增加，从而增加了信号衰减。本文介绍了几种商用覆铜层压板和金属化陶瓷基板上粗糙金属表面方阻的测量。
In copper cladded laminates copper foil is roughened to promote adhesion of the dielectric resin. Sheet resistance of rough metal surfaces increases as a function of frequency, thus increasing signal attenuation. In this paper we present measurements of the sheet resistance of rough metal surfaces on several commercially available copper cladded laminates and on metalized ceramic substrates.