An SiC MESFET-Based MMIC Process

An SiC MESFET-Based MMIC Process
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DOI:
10.1109/tmtt.2006.885563
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发表时间:
2006-12
影响因子:
4.3
通讯作者:
M. Sudow;K. Andersson;N. Billstrom;J. Grahn;H. Hjelmgren;J. Nilsson;P. Nilsson;J. Ståhl;H. Zirath;N. Rorsman
M. Sudow;K. Andersson;N. Billstrom;J. Grahn;H. Hjelmgren;J. Nilsson;P. Nilsson;J. Ståhl;H. Zirath;N. Rorsman
中科院分区:
工程技术1区
文献类型:
--
作者:
M. Sudow;K. Andersson;N. Billstrom;J. Grahn;H. Hjelmgren;J. Nilsson;P. Nilsson;J. Ståhl;H. Zirath;N. Rorsman

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基于自主研制的SiC MESFET工艺,开发了单片微波集成电路(MMIC)工艺。该工艺采用微带技术,并已开发出一套完整的无源元件,包括MIM电容、螺旋电感、薄膜电阻和通孔。该工艺的潜力通过一个3GHz的8W功率放大器、一个三阶截点为38dBm的高线性度S波段混频器和一个高功率限幅器来证明
A monolithic microwave integrated circuit (MMIC) process based on an in-house SiC MESFET technology has been developed. The process uses microstrip technology, and a complete set of passive components, including MIM capacitors, spiral inductors, thin-film resistors, and via-holes, has been developed. The potential of the process is demonstrated by an 8-W power amplifier at 3 GHz, a high-linearity S-band mixer showing a third-order intercept point of 38 dBm, and a high-power limiter