Electrochemical depositing rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity and heat transfer performance compared to pure Ti
Electrochemical depositing rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity and heat transfer performance compared to pure Ti
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DOI：
10.1088/1361-6528/aa538b
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发表时间：
2017-01
期刊：
影响因子：
3.5
通讯作者：
Jing Wang;Huatao Wang;Wenying Zhang;Xinyi Yang;G. Wen;Yijie Wang;Weiwei Zhou
中科院分区：
文献类型：
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作者：
Jing Wang;Huatao Wang;Wenying Zhang;Xinyi Yang;G. Wen;Yijie Wang;Weiwei Zhou
钛及其合金在高强度、轻重量等方面有着广泛的应用，但其导热系数较低，限制了其进一步的应用。在本文中，我们实验表明，rGO-Ti-rGO异质基板具有更高的热导率，高达38.8%以上的Ti，可以通过电化学沉积rGO在其表面上制造。rGO层生长在Ti衬底的表面上，具有床上的被褥的外观。当沉积5个循环和10个循环时，rGO层的厚度分别为约300-500 nm和约600-1000 nm。根据冷却实验结果，所制备的Ti + rGO衬底可以呈现出优异的导热性能，并且在热流密度为0.4-3.6 W cm−2的情况下，将芯片温度降低至比Ti合金衬底低接近3.2 °C-13.1 °C。最后，在钛基片表面电化学存款数百纳米rGO层的方法可以提高其导热性和传热性能，这可能在其他金属合金、陶瓷和聚合物的导热性方面有进一步的应用。
Titanium (Ti) and its alloys are widely applied in many high strength, light weight applications, but their thermal conductivity is lower compared to that of other metals, which limits their further applications. In this paper, we demonstrated experimentally that rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity, up to ∼38.8% higher than Ti, could be fabricated by electrochemical depositing rGO on their surface. The rGO layers are grown on the surface of Ti substrates, with appearance of bedclothes on the beds. The thickness of rGO layers is around 300–500 nm and around 600–1000 nm when deposited for 5 cycles and 10 cycles, respectively. According to the cooling experiment results, as-prepared Ti + rGO substrates can present excellent thermal conduction performance, and reduce the chip temperature close to 3.2 °C–13.1 °C lower than Ti alloy substrates with the heat flow density of 0.4–3.6 W cm−2. Finally, the approach to electro-chemically deposit hundreds of nanometer rGO layers on the surface of Ti substrates can improve their thermal conductivity and heat transfer performance, which may have further application in the increasing thermal conduction of other metal-alloys, ceramics and polymers.