Measurement of Biaxial Stress Using Electrodeposited Copper Foil with a Microcircular Hole : Method Using the Probability of the Occurrence of Slip
Measurement of Biaxial Stress Using Electrodeposited Copper Foil with a Microcircular Hole : Method Using the Probability of the Occurrence of Slip
复制标题
使用带微圆孔的电解铜箔测量双轴应力：利用滑移发生概率的方法
DOI：
10.1299/jsmea1993.39.4_533
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发表时间：
1996
期刊：
影响因子：
--
通讯作者：
J. Hasegawa
中科院分区：
文献类型：
--
作者：
S. Kitaoka;Jianqiao Chen;N. Egami;J. Hasegawa
本文研究了在电镀铜箔上光刻形成的微圆孔周围滑移带的出现与平面弯曲和循环扭转的循环次数和循环应力大小的关系。结果表明，主应力在一个元素下的双向应力，这是无法检测的常规镀铜方法，可以使用一个方程的基础上的滑移发生的概率，它考虑到循环应力的大小和循环次数进行评估。
The dependence of slip band occurrence at the periphery of microcircular holes formed by photoetching in electrodeposited copper foil upon the number of cycles and cyclic stress magnitude for plane bending and cyclic torsion is examined. The results show that the principal stresses in an element under biaxial stresses, which are undetectable by the conventional copper electroplating method, can be evaluated using an equation based on the probability of slip occurrence, which takes into account both cyclic stress magnitude and the number of cycles.