Performance Test of 20-Stacked Two-Tapes-Bundled REBCO Pancake Coils for Upgrading of 25-T Cryogen-Free Superconducting Magnet to 30 T

Performance Test of 20-Stacked Two-Tapes-Bundled REBCO Pancake Coils for Upgrading of 25-T Cryogen-Free Superconducting Magnet to 30 T
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DOI:
10.1109/tasc.2023.3252496
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发表时间:
2023
影响因子:
1.8
通讯作者:
K. Takahashi;A. Badel;A. Zampa;T. Okada;S. Awaji;G. Nishijima;T. Uto;H. Takewa;S. Hanai;S. Ioka;J. Inagaki
K. Takahashi;A. Badel;A. Zampa;T. Okada;S. Awaji;G. Nishijima;T. Uto;H. Takewa;S. Hanai;S. Ioka;J. Inagaki
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
K. Takahashi;A. Badel;A. Zampa;T. Okada;S. Awaji;G. Nishijima;T. Uto;H. Takewa;S. Hanai;S. Ioka;J. Inagaki

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对于下一代高场无低温超导用户磁体,我们采用了一个强大的线圈的概念,它包括两个磁带共缠绕在一个面对面的配置,氟涂层聚酰亚胺磁带作为束间绝缘和薄玻璃钢板粘在线圈边缘。为了验证我们的线圈设计,我们研究了在4.2 K下在14 T的背景场下用Fujikura EuBCO带缠绕的20个堆叠的REBCO扁平线圈的电磁和电流-电压特性。弹簧圈的内径、外径和总高度分别为68 mm、266 mm和101 mm。在通过BJR关系估计的370 MPa的环向应力下,在20个堆叠线圈的中间平面处的最外绕组上测量的环向和轴向应变的平均值分别为0.23%和-0.15%。线圈的I-V特性在由线圈和背景场总共产生的25 T下没有显示出异常行为,这表明我们的线圈结构具有抵抗大电磁应力的优势。
For next generation of high field cryogen-free superconducting user magnets, we adopt a robust coil concept, which consists of two tapes co-wound in a face-to-back configuration, a fluorine-coated polyimide tape as the inter-bundle insulation and thin FRP plates glued on the coil edges. To validate our coil design, we investigated electromagnetic and current-voltage properties of 20-stacked REBCO pancake coils wound with Fujikura EuBCO tapes with the robust coil concept at 4.2 K under a background field of 14 T. The inner and outer diameters and total height of the coils are 68 mm, 266 mm, and 101 mm, respectively. The average of measured hoop and axial strain on the outermost winding at the mid plane of the 20-stacked coils were 0.23% and −0.15% respectively at a hoop stress of 370 MPa estimated by the BJR relation. The I-V properties of the coils showed no anomalous behavior up to 25 T totally generated by the coils and background field, suggesting that our coil structure has an advantage against large electromagnetic stress.