Analysis of elastic and plastic deformation associated with indentation testing of thin films on substrates
Analysis of elastic and plastic deformation associated with indentation testing of thin films on substrates
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DOI：
10.1016/0020-7683(88)90091-1
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发表时间：
1988
影响因子：
3.6
通讯作者：
A. Bhattacharya;W. Nix
中科院分区：
文献类型：
--
作者：
A. Bhattacharya;W. Nix
本文用有限元法研究了基片上薄膜亚微米压痕的弹塑性变形。薄膜和基体的弹性和塑性特性对薄膜/基体复合材料硬度的影响通过确定压头下的平均压力作为压痕深度的函数进行了研究。已经对基底比膜硬或比膜软的膜/基底组合以及基底比膜硬或比膜更柔顺的组合进行了计算。结果发现，正如预期的那样，硬度随着压痕深度的增加时，无论是屈服强度或弹性模量的基板是高于薄膜。相应地，当基体的屈服强度或弹性模量低于薄膜的屈服强度或弹性模量时，硬度随压痕深度的增加而降低。已开发的函数方程来预测这些不同条件下的硬度随深度的变化。载荷位移曲线的卸载部分的有限元模拟允许确定作为压痕深度的函数的膜/基底复合材料的弹性顺应性。使用该信息可以将膜的弹性性质与基底的弹性性质分开。结果是在很好的协议与国王的分析处理这个问题。
A study has been made of the elastic and plastic deformation associated with submicrometer indentation of thin films on substrates using the finite element method. The effects of the elastic and plastic properties of both the film and substrate on the hardness of the film/substrate composite are studied by determining the average pressure under the indenter as a function of the indentation depth. Calculations have been made for film/substrate combinations for which the substrate is either harder or softer than the film and for combinations for which the substrate is either stiffer or more compliant than the film. It is found, as expected, that the hardness increases with indentation depth when either the yield strength or the elastic modulus of the substrate is higher than that of the film. Correspondingly, the hardness decreases with indentation depth when the yield strength or elastic modulus of the substrate is lower than that of the film. Functional equations have been developed to predict the hardness variation with depth under these different conditions. Finite element simulation of the unloading portion of the load displacement curve permits a determination of the elastic compliance of the film/substrate composite as a function of indentation depth. The elastic properties of the film can be separated from those of the substrate using this information. The results are in good agreement with King's analytical treatment of this problem.