Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory
Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory
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DOI：
10.1149/1.2358119
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发表时间：
2006-12
影响因子：
3.9
通讯作者：
Jie Zhao;Ning Li;Guofeng Cui;Jian-wei Zhao
中科院分区：
文献类型：
--
作者：
Jie Zhao;Ning Li;Guofeng Cui;Jian-wei Zhao
用电化学、X射线荧光光谱和Hartree-Fock理论方法研究了锡在铜表面的化学沉积。根据浸锡电位曲线和镀层结构的分析，认为次磷酸盐型浸锡反应是两个串联过程。第一置换过程受亚铜络合剂和SnSO 4浓度的影响较大，主要是由于形成了Cu-Sn合金和较薄的锡层。第二个过程归因于亚锡离子在较高温度下被次磷酸盐还原。
Electroless deposition of tin onto copper surface has been studied by means of electrochemistry, X-ray fluorescence spectrometry, and theoretical Hartree-Fock methods. There are two processes in series involved in the hypophosphite-type immersion tin reaction, based on the analysis of the immersion tin potential curves and the structure of the deposits. The first displacement process is significantly affected by the complexing agents of cuprous and the concentration of SnSO 4 , mainly due to the formation of Cu-Sn alloy and a thinner tin layer. The second process is attributed to the stannous ion reduction by hypophosphite at higher temperatures.