Transient liquid-phase bonding in the NiAl/Cu/Ni system-A microstructural investigation
Transient liquid-phase bonding in the NiAl/Cu/Ni system-A microstructural investigation
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DOI：
10.1007/bf02595453
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发表时间：
1996-11
期刊：
影响因子：
--
通讯作者：
W. Gale;Y. Guan
中科院分区：
文献类型：
--
作者：
W. Gale;Y. Guan
A transmission electron microscopy based investigation of microstructural development in NiAl-Ni transient liquid bonding, using commercial purity copper interlayers, is presented in this article. The article considers the mechanisms of isothermal solidification in NiAl/Cu/Ni joints and the influence of copper diffusion from the joint centerline on the microstructures of the adjacent NiAl and Ni substrates. Changes in the microstructure of the bond centerline due to entry of aluminum (from the NiAl substrate) and Ni (from both the NiAl and the Ni substrates) are discussed. Transfer of aluminum from the NiAl substrate to the Ni substrate is also examined. The precipitation of bothLl2typeγ′ andB2typeβphases at the joint centerline is investigated. Precipitation ofγ′ within both the NiAl and Ni substrates is considered. The formation ofAl typeγphases in the NiAl substrate is also examined.
