Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling
Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling
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DOI：
10.1007/s11664-022-09643-2
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发表时间：
2022-05
影响因子：
2.1
通讯作者：
Ankita Roy;Amey Luktuke;N. Chawla;K. Ankit
中科院分区：
文献类型：
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作者：
Ankita Roy;Amey Luktuke;N. Chawla;K. Ankit
