Quantitative Analysis of the Effect of Hydrogen Diffusion from Silicon Oxide Etch-Stopper Layer into Amorphous In-Ga-Zn-O on Thin-Film Transistor
Quantitative Analysis of the Effect of Hydrogen Diffusion from Silicon Oxide Etch-Stopper Layer into Amorphous In-Ga-Zn-O on Thin-Film Transistor
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DOI:
10.1109/ted.2014.2359739
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发表时间:
2014-11-01
影响因子:
3.1
通讯作者:
Furuta, Mamoru
中科院分区:
文献类型:
--
作者:
Toda, Tatsuya;Wang, Deapeng;Furuta, Mamoru
To investigate the effect of hydrogen diffusion from the silicon oxide etch-stopper (SiOx ES) layer into the amorphous In-Ga-Zn-O (a-IGZO) on thin-film transistor (TFT) properties and stabilities, we fabricated a-IGZO TFTs with a SiOx ES layer deposited by plasma-enhanced chemical vapor deposition at various silane (SiH4) partial pressures (P[SiH4]). Then, quantitative analysis was performed to investigate the relationship between the hydrogen content of the a-IGZO and electrical properties and stability of the TFTs. We found that a low resistance region was formed at the backchannel of the TFT, when the SiOx ES layer was deposited at higher P[SiH4], leading to a drastic negative threshold voltage (V-th) shift. In addition, it was also found that at the frontchannel, the increase in the carrier concentration of a-IGZO was proportional to the increase in the amount of hydrogen in a-IGZO. On the other hand, when P[SiH4] was increased, the subthreshold swing, hysteresis, and gate-bias stability of the TFT improved. The results indicate that hydrogen diffused from the SiOx ES layer passivates the electron traps at the a-IGZO and/or gate insulator/a-IGZO interface, and almost all of the hydrogen also acts as shallow-donor in a-IGZO.