Measurement of Residual Particles by High-Intensity Aerial Ultrasonic Waves
Measurement of Residual Particles by High-Intensity Aerial Ultrasonic Waves
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高强度航空超声波测量残留颗粒
DOI：
10.1143/jjap.38.3312
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发表时间：
1999
影响因子：
1.5
通讯作者：
A. Miwa
中科院分区：
文献类型：
--
作者：
Youichi Ito;S. Nakayama;A. Miwa
当高强度空中超声波（频率约为20-50kHz）作用于附着在物体表面的液滴时，液滴会瞬间雾化并从物体上剥离并散布在空气中。如果施加极强的声波（约170dB（声压级；SPL）），也有可能导致残留在物体表面的固体颗粒剥落并散落在空气中。在本报告中，我们描述了一项研究，其中我们研究了一种新方法，该方法利用空中超声波产生的上述效果来定量评估经过精密清洗的半导体制造夹具的表面残留颗粒的清洁度。该方法具有多种特点，包括（1）可以在不接触目标物体的情况下进行，（2）可以在物体的特定区域上使用，（3）不依赖于物体的形状，（4）可以轻松进行测量。
When high-intensity aerial ultrasonic waves (with a frequency of approximately 20–50 kHz) are applied to drops of liquid adhering to the surface of an object, the drops instantaneously atomize and peel off from the object and scatter in the air. If extremely strong sound waves (approximately 170 dB(sound pressure level; SPL)) are applied, it is also possible to cause the solid particles remaining on the surface of an object to peel off and scatter in the air. In this report, we describe a study in which we investigated a new method that uses the above-mentioned effects produced by aerial ultrasonic waves to quantitatively evaluate the cleanness, with regard to the particles remaining on their surface, of semiconductor manufacturing jigs that have been precision-cleaned. This method has various features, including (1) it can be conducted without touching the target object, (2) it can be used on a specific area of the object, (3) it does not depend on the shape of the object, and (4) its measurements can be easily carried out.