3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect
3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect
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考虑电源/地平面谐振耦合和过孔颈效应的 3GHz 通孔信号过孔模型
DOI：
10.1109/ectc.2003.1216414
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
Joungho Kim
中科院分区：
文献类型：
--
作者：
J. Pak;Joungho Kim
我们描述了一个等效电路模型的通孔信号过孔在多层印刷电路板（PCB）的频率高达3 GHz。除了过孔本身，电源/接地平面（平行板腔）谐振和过孔颈部效应也反映在模型中。通过S参数测量和随后的优化拟合过程提取模型参数。利用所提出的模型，可以准确地估计到电源/接地平面谐振的信号耦合。此外，它是由近场探针测量表明，从电源/接地层的边缘的辐射发射有密切的相关性，通孔信号过孔。
We describe an equivalent circuit model of a through-bole signal via in a multi-layer printed circuit board (PCB) for frequencies up to 3 GHz. In addition to the via itself, power/ground plane (parallel plate cavity) resonance and via neck effects are also reflected in the model. The model parameters are extracted by S-parameter measurement and a subsequent optimization fitting process. With the proposed model, the signal coupling to the power/ground plane resonance can be accurately estimated. Furthermore, it is demonstrated by near-field probe measurement that the radiated emission from the edge of power/ground planes has intimate correlation to the through-hole signal via.