Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation

Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation
复制标题

飞秒激光烧蚀薄硅基板钻孔的时间分辨图像分析

DOI:
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发表时间:
2005
期刊:
Japanese Journal of Applied Pysics 44・11
影响因子:
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通讯作者:
A.Yokotani
A.Yokotani
中科院分区:
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文献类型:
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作者:
K. Oshida;T. Minamizawa;T. Miyazaki;Y. J. Kim;M. Endo;A.Yokotani

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