Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation
Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation
复制标题
飞秒激光烧蚀薄硅基板钻孔的时间分辨图像分析
DOI:
--
复制
发表时间:
2005
期刊:
影响因子:
--
通讯作者:
A.Yokotani
中科院分区:
文献类型:
--
作者:
K. Oshida;T. Minamizawa;T. Miyazaki;Y. J. Kim;M. Endo;A.Yokotani