Technological Integration in Printed Electronics
Technological Integration in Printed Electronics
复制标题
印刷电子技术集成
DOI：
10.5772/intechopen.76520
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
Aniello Falco
中科院分区：
文献类型：
--
作者：
A. Rivadeneyra;F. Loghin;Aniello Falco
传统的电子器件需要使用许多沉积技术（例如，化学气相沉积、物理气相沉积和光刻），这些沉积技术具有要求高的性能。
超高真空、高温和洁净室设施等条件。在过去的几十年里，印刷电子（PE）已经证明了标准印刷技术的使用
以开发具有新特征的电子器件，例如大面积制造、机械柔性、环境友好性和潜在的成本效益。这种
对于物联网（IoT）的流行概念而言，设备的数量尤其令人感兴趣，在物联网中，所采用的电子设备的数量大量增加。因为如此
在这种趋势下，成本和环境影响正逐渐成为一个实质性问题。
然而，在这种情况下，PE要想成为真实的竞争者，需要克服的主要技术障碍之一是将这些非传统技术整合到每一个
其他和嵌入这些设备在标准的电子产品。本章总结了在这方面取得的进展，重点介绍了不同技术的使用，
一个工艺流程以及印刷电子产品与传统系统的集成
Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding
conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques
to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and—potentially—cost effectiveness. This kind
of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this
trend, the cost and environmental impact are gradually becoming a substantial issue.
One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each
other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in
one process flow and the integration of printed electronics with conventional systems