Experimental study on micro-drills wear during high speed of drilling IC substrate
Experimental study on micro-drills wear during high speed of drilling IC substrate
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DOI：
10.1108/cw-11-2013-0048
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发表时间：
2014-07
期刊：
影响因子：
0.9
通讯作者：
Linfang Wang;Lijuan Zheng;C. Wang;S. Li;Y. Song;Lunqiang Zhang;Peng Sun
中科院分区：
文献类型：
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作者：
Linfang Wang;Lijuan Zheng;C. Wang;S. Li;Y. Song;Lunqiang Zhang;Peng Sun
目的：与传统的印制电路板(PCB)钻孔工艺相比，IC基板钻孔技术面临着更多的问题，如孔直径更小、孔间距更密集、板材更薄、加工材料更复杂等。此外，IC基板的基材不同于传统的印制板，在IC基板中加入了更多种类的填料，使得钻头在钻削过程中磨损严重。到目前为止，微钻磨损和微孔质量是IC基板钻削过程中最重要的问题。本文对微细钻头的磨损形态、孔壁粗糙度和孔位精度进行了研究。研究了微细钻头磨损和微小孔质量的影响因素。本文旨在探讨这些问题。设计/方法/途径-使用两个相同结构、不同直径的钻头来钻不同叠层的IC基板，钻出不同的孔。有一个..。
Purpose – Compared with the traditional printed circuit board (PCB) drilling process, the technology of drilling IC substrate is facing more problems, such as much smaller hole diameter, more intensive hole space, thinner sheet and more complicated materials are drilled in process. Moreover, the base material of IC substrate is different from traditional PCB, more kinds of fillers added in IC substrate which make the drill worn seriously during drilling process. Micro-drills wear and micro holes quality are the most important questions when drilling IC substrate so far. Wear morphology of micro-drill, holes wall roughness and hole location accuracy are researched in this paper. The influence factors of micro-drills wear and micro holes quality are also studied in this drilling process. The paper aims to discuss these issues. Design/methodology/approach – Two drills with same structure and different diameter are used to drill different stacks of IC substrate and drill different holes in this paper. There a...