Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc
Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc
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铜的电化学原子层沉积：通过表面限制氧化还原取代欠电势沉积锌介导的无铅工艺
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
R. Akolkar
中科院分区：
文献类型：
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作者：
K. Venkatraman;Ryan R. Gusley;Lung;Y. Dordi;R. Akolkar
